Manufacturing Support

Manufacturing Support

Cerium Labs has years of experience supporting
various industries with their manufacturing needs.

Process control

Keeping your processes running within your specifications is critical to your business. Whether you are producing raw materials or final product, regardless of the type of process you need to control Cerium Labs is able to provide support for all your routine testing.

Methods of analysis

  • Thin Film composition (% level) by XPS 
  • Critical dimensions of patterns or film thicknesses by SEM or TEM
  • Trace metals contamination on Si wafers by VPD-ICPMS
  • Trace metals in water and chemicals by ICPMS
  • Dopants profiling and tool matching using SIMS

Environment Testing

Your manufacturing area is key to the quality of your product. Cerium Labs can perform manufacturing environment testing. Volatile organics from various processes can be trapped in media and analyzed. Air testing can be performed during suspect processes or during down periods to determine baseline contamination.

Methods of analysis

  • Trapped volatile organics from air or process line by GCMS
  • Witness wafers verify trace metals levels in cleanroom areas by VPD-ICPMS

Process Development

Bringing new processes or products on line in the shortest amount of time is necessary to keep up with industry trends. Cerium Labs can assist in the qualification of tools and recipes. We have extensive experience with Design of Experiments and can support your engineering staff in analyzing their materials to determine which process is the best choice.

Methods of analysis

  • Thin Film composition (% level) by XPS
  • Critical dimensions of patterns or film thicknesses by SEM or TEM
  • Trace metals contamination on Si wafers by VPD-ICPMS
  • Dopants profiling and tool matching using SIMS

Failure Analysis – Root Cause Analysis

When yields are hit by a manufacturing issue, the fastest fix is never fast enough.Cerium Labs’ experts can quickly help you identify where the failure is occurring and offer suggestions on how to solve those yield issues. We will work with your engineering staff to understand the process and design experiments to partition the process and pin point the failure.

Methods of analysis

  • Thin Film composition (% level) by XPS
  • Contamination issues by XPS, EDS or FTIR
  • Pattern verifications or defect issues by SEM or TEM
  • Dopant profiling and tool matching using SIMS

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